G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current This Test Method is intended

This Test Method is intended for rapid carrier density determination when extended sample preparation time or high temperature processing of the wafer is not practical

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and their interchangeability at all mechanical interfaces

and automated test equipment

SEMI E37-0303 (designation update)

SEMI M62-1105 (first published - replaces SEMI M2 and SEMI M11)

G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current This Test Method is intendedMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The characteristics